Evolving Memory Role in Future Mobility


December 7, 2022 | 11:00 AM IST


The continuous advancement of electronic technology and the impact of global warming will drive the future of new car-making technologies to shift from tradition to innovation.

The new developments and different application scenarios of the automotive market in the future will change human life soon.

The four major directions of CASE (Connectivity, Autonomous, Sharing, Electrification) are the focus of the mobility industry. We will focus on key applications and explain the future role of memory from the perspective of memory.

This Webinar Covers

  • Car E/E architecture transforms from distributed ECU to Domains and Zones architecture.
    Total BOM cost thinking will always be the key to build a car.
  • Connected cars/OTA function/ADAS enable more service content to enhance user experiences. Cybersecurity/Functional safety key topics.
  • Power Management will become critical for new car design, aided by new type of memory and processor technologies
  • System architecture becomes more powerful & complex, edge processing to assist might be the solution to achieve the robust performance.
  • Winbond DRAM and Flash assist computing and storage for different applications in mobility.
    We continue to support customers and contribute the industry by providing sustainable semiconductors to enrich human life.

Featured Speaker


Assistant Sales Manager


Mohammed Sadique Anwar is the Assistant Sales Manager within Winbond Electronics Corporation for last 5 years. Overall, he has 11 years’ experience of semiconductor Industry for various products, applications and markets. He started his first job in 2013 as a Nuvoton Academic Program Manager under sales and marketing division in Nuvoton Technology Corporation-Taiwan to promote ARM Cortex-M0 based 32Mbit Microcontroller.  After two years, he moved to Analog Integrations Corporation-Taiwan as Senior Sales Representative to promote Power IC & LED Driver IC for India, SEA & EMEA region. He holds Master of Science (Semiconductor Engineering) from Asia University Taiwan.      

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