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India Opportunities in Semiconductor Packaging - Sector Wise Perspective of an OSAT

Held On: 04th December 2021, Saturday
Venue: TechWorldCongress.com
Time: 11:00 - 12:30 Hrs IST

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This Session Will Cover

OSAT tech roadmaps are envolving with the focus on

Sectorwise Perspective of an OSAT

  • Cost reduction aimed at lowering cost/interconnect
  • Yield enhancement with move towards Middle-end-of-line technologies and shifts towards wafer level packaging – and now panel-level packaging.
  • Tech enhancements that drive more towards advance systems-in-package architectures.
  • This discussion will also explore the opportunity for an OSAT in tapping the Automotive, Fintech, Consumer,  Telecom/Power electronics market in India.               
  • Contextually brings out the potential synergies between

     Government, Industry and OSAT for creating the Indian Markets…

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